高散热铝基覆铜板 铝基覆铜板

绝缘铝电路基板insulate metal substrate aluminum circuit board

特 点：1)优异的导热性能；2)优异的耐热性；3)高绝缘性能；4)优良的平整度；5)绿色环保；

应用领域：1)用于制作大功率、大电流、高密度、高功耗的电路基板，具有优异的散热性，实现电路组装的高可靠性和长寿命性。2)用于制作电路与外壳一体化组装，实现电路组装的短、小、轻、薄化。3)用于制作三维立体空间的电路组装，基板具有可弯曲和可变形性。4)用于制作需要进行电磁屏蔽的电路组装中。5)用于制作需要进行高耐热冲击的电路组装中。6)用于制作对于大面积陶瓷基板组装电路困难的电路组装，克服陶瓷基板的脆性，提高可加工性。7)适合绿色环保电路的组装。8)其它新型电路组装。

features and benefits：1)excellent thermal dissipation; 2)excellent thermal resistance;3) high insulation;4)premium parallel properties;5) green environmental.

applications：they are suitable for power hybrid boards where thermal and electromagnetic noise is a problem. with excellent mechanical process ability, they can be bent and press-molded for use as three-dimensional printed wiring boards. it is being used in standard and state-of-the-art power supplies with thermal multiplayer boards, and in many other high volume commercial, industrial, military and space products including appliance, automotive, tv deflection, audio power, single-board computers, telecommunication, satellite, and more.

主要性能general properties（testing accord toipc-4101）