c66 100-2/yj型硅片倒角机

产品用途:

本设备适用于切片或磨片后金属、非金属等硬脆性材料的周边倒角。

主要技术参数:

1.砂轮尺寸（外径×内径×厚度）：φ50mm×φ9mm×6mm

2.主轴转速：倒角转速3～5rpm

甩干转速0～7000rpm

冲洗转速0～4500rpm

3.倒角硅片直径：φ35～100mm

4.倒角硅片厚度：0.3～1.5mm

5.承片头尺寸：30mm40mm66mm86mm四种

6.外电源：交流220v300w

7.外形尺寸（长×宽×高）：700mm×500mm×380mm

8.质量：约60kg

c66 100-2/yj silicon wafer chamfering machine

application:

this equipment can be used for chamfering/beveling silicon wafers or other hard, fragile flat materials after cutting or grinding.

main technical parameters:

1.dimensions of grinding wheel (outer dia.×inner dia.×thickness):ф50mm?ф9mm?6mm

2.rotation speed of the main shaft:

(1). rotation speed while chamfering/beveling:3 ~ 5rpm

(2). rotation speed while drying:0 ~ 7000rpm

(3). rotation speed while watering:0 ~ 4500rpm

3. diameter of silicon wafers:ф35mm~ф100mm

4. thickness of silicon wafers:0.3 ~ 1.5mm

5. dimensions of carriers:30mm or 40mm or 66mm or 86mm

6. power:220v 0.3kw

7. machine dimensions(l?w?h):700mm?500mm?380mm

8. machine weight:about 60kg