设备尺寸 |
548mm*592mm*1360mm |
重量 |
180 kg |
功率 |
560 w |
气压供应 |
5 bar≤P≤7 bar |
机器动作 控制原理 |
使用各向异性导电胶热压固化封装, 天线自动进料,手动上IC,自动封装 |
压力设定范围 |
50—300g |
可容纳的 产品尺寸 |
天线 ≤100mm×80mm 芯片 0.4mm×0.4mm~2mm×2mm |
温度设定范围 |
50—300 ℃ |
视像系统 |
2个视觉定位系统 天线与芯片的定位 |
附带功能 |
成品标签的检测系统 |
生产效率 |
240—300 pcs/hr |
贴片精度 |
50 μm |
适应的基板材料 |
PET PVC PAPER |
适应的粘接材料 |
ACA NCA ICA |
Dimension |
548mm*592mm*1360mm |
Weight |
180 kg |
Power |
560 w |
Barometric Pressure |
5 bar≤P≤7 bar |
Operation and Principle |
Automatically loading the antenna, manually feeding the chip, Auto-dispensing the ACA and bonding |
Bonding force |
50—300g |
Accommodated Work piece |
Antenna ≤100mm×80mm Chipset 0.4mm×0.4mm~2mm×2mm |
Temperature Range |
50—300 ℃ |
Visual System |
2 visual identify system, chipset&antenna automatically positioning |
Additional system |
Testing system |
Throughput |
240—300 pcs/hr |
Paste Accuracy |
50 μm |
Substrate Material |
PET PVC PAPER |
Adhesive |
ACA NCA ICA |