热塑性电子级酚醛树脂 电子级

quality standards: in accordance with the light industry recognized standards to implemente

these above indicators at home and abroad are epoxy molding compounds for the gm industry standards, customers can also order low-softening , low viscosity value of the product .

use: e-grade phenolic resin of the phenol formaldehyde condensation from the high purity of linear thermal plastic phenolic resin, epoxy molding material is hardening agent, is the general upgrading of the 2132 resin products. adaptation in the electronics, electrical appliances, aerospace and other industries, is a new type of phenolic resin; products are widely used in glass fiber reinforced plastics, phenolic laminate, phenolic-plastics, integrated circuits electric and electronic devices molding, a special heat-resistant insulation materials and civilian electrical appliances, and so on.

packaging: thenet weight is20 kg,use the paper models compound bags, lined with plastic bags.

storage and transport: the goods should bestored in dry and ventilatoty warehouse , during the transportion, stop raining from being exposed to moisture. llight handling and stacking to prevent the packaging from damaging, when they are stored, separate storagefrom toxic substances.