Features
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Tiny plastic SMD package.
High current capability.
High surge capability.
Glass passivated chip junction.
Mechanical data
Case : Molded plastic, SOD-123FL
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : Approximated 0.01gram
备注:更多参数请访问http://www.luguang.cn/web/productPDF/FM4001-M.pdf