component stenciling templatesok international has designed a unique tool, component stenciling templates, for printing on the underside of components. this easy procedure is designed for use on pbga, cbga, csp balled devices as well as land grid array (lga) components. this is an ideal process for small components and situations where traditional stencil access is limited by the close proximity of adjacent components. | | | component stenciling templates | | part no. | array package | | bst-169 | 169 full matrix array | | bst-225 | 225 full matrix array | | bst-256 | 256 full matrix array | | bst-256p | 256 perimeter array | | bst-256fp | 256 fine-pitch full matrix array | | bst-272p+16 | 272 perimeter array with 16 inner | | bst-303 | 303 full matrix array | | bst-324 | 324 full matrix array | | bst-352p | 352 perimeter array | | bst-357 | 357 full matrix array | | bst-492 | 492 full matrix array | | cst-46 | 46 ball micro bga | | brp-lda16a | nsc llp 16 pin dual in-line | | brp-lqa16a | nsc llp 16 pin quad | | brp-lqa24a | nsc llp 24 pin quad | | brp-lqa44a | nsc llp 44 pin quad |
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