皮秒激光切割机 FPC紫外激光切割机

产品详情

用途/USAGE

适用于覆盖膜（CVL）、柔性板（FPC）、软硬结合板（RF）和薄多层板的切割成形，以及开窗盒揭盖；可扩展用于切割各种基材，如陶瓷、硅片等。The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board,as well as cutting a variety of substrates, such as ceramic,silicon etc.

特征/CHARACTERISTICS

真正冷加工，基本无炭化；

Completely cold cutting, almost no carbonizing.

效率高，相对纳秒加工，切割速度可以提高数倍；

High effiency,times speed higher than nano laser cutting.

双台面，零上下料时间，题升加工效率；

Easy to use software interface,easy to learn.

加工前预览功能，避免切板报废；

Preview function before processing to avoid damaging sample.

相对于纳秒激光加工，碳化极其微弱;

Carbonization is extremely weak compared to nanosecond laser processing.

相对于纳秒加工，速度可提高数倍；

Speed can be increased several times compared to nanosecond processing.

加工面更加精细光滑，整齐，干净；

The processing surface is more fine, smooth, tidy and clean;

除了传统的电路板高分子材料和铜箔等加工，皮秒还可以加工，陶瓷，硅片，铁氟龙等材料；

In addition to traditional circuit board polymer materials and copper foil processing, picoseconds can also be processed, ceramics, silicon wafers, Teflon and other materials;

支持EMCS,MES系统，利用识别二维码自动取舍切割图形单元；

Support EMCS, MES system, use the identification of two-dimensional code to automatically select and cut the graphics unit;