EBSO SPA-500选择性波峰焊

spa-500 modular
semi and fully automated selective soldering plattform

inline version

conveyor, gripper unit, fluxer, dual preheater and solder pot
here shown a dipping process

ebso spa 500 modular
reliable soldering quality at easy operation and highest flexibility

ebso selective soldering system spa 500 modular

equipment base system

xyz – axis carrier system with servo drives

soldering angle 0° and 7°

max. pcb size and max solder area 510 x 510 mm

max. frame/fixture size 550 x 550 mm

sprayfluxer for single point and line fluxing with 2 l flux pot and flux level control

titanium pot and pump unit suitable for lead free solder alloys with quick release pump

1 universal – solder frame

incl. one 5 mm jet wave standard nozzle and standard n2 cover ring

siemens s7 touchscreen panel
timer
maintenance control
password protected

exhaust control sensor

n2 and air control

light-tower

internal light

nozzle changeover tooling, safety cloves, solder tool

manual loading system

fixture recognition

options:

dual nozzle for simultaneous soldering to double the throughput

integrated in the dual nozzle system is the center pump system to run 2 different nozzles in one solder pot if pcb size fits.

4 fluxer (2 drop, 2 spray or 4 spray fluxer)

2 flux tanks for different fluxers

adjustable preheater and top side preheater

inline

2 solder pots in for a max solder area of 510 x 510 mm on both pots
i.e. 1 pot dipping process and one pot for mini wave.