铝基覆铜箔板 铝基覆铜板

aluminum copper clad aluminum plate is one of the raw materials, which is based on electronic fiberglass cloth or other reinforcing material impregnated with resin, a single resin insulation adhesive layer, one or both sides coated copper foil and hot pressingmade of a plate material called copper-clad laminate aluminum plate, referred to as aluminum ccl aluminum ccl as a substrate material in the manufacture of printed circuit boards, printed circuit board from the maininterconnect conductive, insulating and supporting role, the transmission speed of the circuit signals, energy losses and the characteristic impedance has a great influence to the performance of the printed circuit board, , manufacturing workability, manufacturing level, manufacturingcost and long-term reliability and stability depend largely on the aluminum ccl.
aluminum copper clad laminate manufacturing industry is a sunrise industry, it is accompanied by the development of electronic information and communications industry, and has broad prospects for development, high-tech manufacturing technology is a multidisciplinary cross each other, mutual penetration, the mutual promotion. with the electronic information industry, especially with the printed circuit industry simultaneous development, indivisible. its progress and development, has been driven by electronic machine products, semiconductor manufacturing technology, electrical installation technology and printed circuit board manufacturing technology innovation and development.

本产品的加工定制是是，种类是铝基覆铜板，绝缘材料是玻璃布基板，表面工艺是防氧化处理/OSP，Zui小线宽间距是600*1200，板厚度是1.2（mm），粘结剂树脂是环氧，特性是高散热型