美国UDM AKLC300系列浓缩晶圆切削液

l          AKLC300洗涤剂浓缩液是一种可生物降解、水性、非碱性、非酸性物质

l          PV wafer Cleaning after wafering

用于切片之后对光伏硅片进行清洗

l          DI /RO water: Detergent dilution ratio – 1000:1 to 500 :1

去离子水/反渗透水:洗涤剂溶液比例 – 1000:1至500:1

l          Application temperature: 45°C - 70°C

使用温度：45°C - 70°C

l          Excellent wetting, cleaning and rinsing properties 

极好的湿润、清洁和冲洗功能

l          Water surface tension reducer

降低去离子水/反渗透水表面张力

l          Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces

可以彻底清洁硅片表面的碳化硅(SiC)尘埃以及其他脏污

l         Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.

 在切片以及去胶工序之后彻底清除光伏硅片表面的铜和铁

l          Biodegradable, non-hazardous and hence easily disposable 

可生物降解、无危害，可以很容易进行处置

l         Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)

生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L)

l          Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)

化学需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L)

联系人：陈先生

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