硅片浓缩脱胶液

 AKLC300-De-Glue is a biodegradable water based, non caustic and non acidic material
 AKLC300去胶浓缩液是一种可生物降解、水性、非碱性、非酸性物质

 PV wafer De-glue or De-bonding after wafering process
 用于切片之后进行脫膠或脫粘

 DI /RO water: Detergent dilution ratio – 10:1  to  30:1
 去离子水/反渗透水:洗涤剂溶液比例 - 10:1至30:1

 Application Temperature  25°C - 70°C
 使用温度：25°C - 70°C

 Excellent wetting, De-bonding and rinsing properties 
 极好的湿润、脫粘和冲洗功能

 DI / RO water surface tension reducer
 降低去离子水/反渗透水表面张力