电子产业超纯水制备抛光树脂 半导体行业超纯水制备抛光树脂混床 超纯水制备电阻率达18.25M

型式(Type)

强酸性阳离子交换树脂 (Strong acid Cation exchange resin)

强碱性阴离子交换树脂 (Strong base Anion exchange resin)

主体结构(Matrix Structure)

苯乙烯(Cross linked polystyrene)

功能基 (Functional Group)

基(Sulfonic acid)

4级胺(Quaternary ammonium Type I)

物理性貭(Physical Form)

球状颗粒(Moist spherical beads)

离子型式(Ionic form supplied)

氢(Hydrogen)

氢氧(Hydroxide)

粒径范围(U.sh in wet)

16 to 50

粒度范围 (Particle Size)

0.3 to 1.2 mm

微粒含量(Fines Content)

穿过US 50 Mesh小于0.5% (Less than

0.5% passing through 50 U.sh)

总交换容量

(Total Exch. Capacity)

1.8 meq/ml minimum of

99% in hydrogen form

1.0 meq/ml minimum of 90% in hydroxide

form and less than 1% in chloride form

PH范围 (pH Range)

0 to 14

允许温度 (Temp. Stability)

120°C

60°C

溶解率 (Solubility)

Insoluble in all common solvents

溶出有机物(Organic leachable)

Less than 0.2 mg KMNO4

per ml of wet resin

Less than 0.2 mg KMNO4 per ml

of wet resin

密度Backwash settled density

Approx.750 gm/liter

不纯物(Impurities)

Fe=50 ppm(max)

Cu=50 ppm(max)

Cu=50 ppm(max)

Pb=50 ppm(max)

Pb=50 ppm(max)

球粒强度(Bead strength)

Avg. not less than 300g/bead by Chatillon test (ASTM Standard)