PD-20免清洗抗拉尖树脂芯无铅焊锡丝

pd-20免清洗抗拉尖树脂芯无铅焊锡丝的特点；酸值kohmg/g≤200，无游离卤素，焊剂含量flux1.5-2.0wt%，上锡快，适合pcb板和ic芯片等窄间距焊点和焊盘间的电焊和拖焊，能有效克服无铅焊锡焊接时粘度大，润湿性差，易桥连，拉尖等弱点。焊后s.i.r≥2×10^13欧.焊接时飞溅少，烟淡异味少。焊后残留物极少，呈浅色透明。
features:acid kohmg/g≤200，flux1.5-2.0wt%，it is suitable for the narrow space hand soldering and lug soldering on the pcb board with fast soldering spots and lugging tine of lead-free solder.when solder,it produces less splash,less smoke and less smell.after soldering, s.i.r≥2×10^13ω,and the minimum residue looks transparent vitreous.